SawStreet
Picking 2 mil (50um) thick die
Picking 2 mil (50um) thick die
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Up to 8 Inch (200mm) wafer capability
Up to 8 Inch (200mm) wafer capability
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Pick and Place Capability Up to 16 bins
Pick and Place Capability Up to 16 bins
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Reticle Dicing
Reticle Dicing
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Precision Dicing
Precision Dicing
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Picking From Wafer Maps
Picking From Wafer Maps
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Pick and Place To Waffle or GelPaks
Pick and Place To Waffle or GelPaks
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Pick and Place To Waffle or GelPaks
Pick and Place To Waffle or GelPaks
http://www.sawstreet.com/images/SlideShow-110722/Pick_And_Place.jpg
Welcome To SawStreet. SawStreet is a technicial services company providing quick turn grinding, dicing, pick and place and inspection services. Whether you need a small engineering run or a production order, SawStreet can provide a solution that is cost effective and meets your exacting requirements. SawStreet works with a wide range of substrates including Silicon, SiGe, GaAs, GaN, InP, MEMS, and ceramic to name a few. We also work with substrates as thin as 50 microns. Team with SawStreet on your next challenging project!

SawStreet is a Service Disabled Veteran Owned Small Business (SDVOSB)

SawStreet has received ITAR Registration from the United States Department of State.