SawStreet-110722
Precision Dicing
Precision Dicing
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Picking to Waffle or GelPaks
SawStreet picks to waffle packs, gelpaks, grip rings and more.
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SawStreet can dice up to 8" wafers
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2 mil (50 micron) thickness wafer dicing and die pick & place
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Pick_And_Place
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Picking using wafer maps
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Reticle Dicing
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Welcome To SawStreet. SawStreet is a technicial services company providing quick turn grinding, dicing, pick and place and inspection services. Whether you need a small engineering run or a production order, SawStreet can provide a solution that is cost effective and meets your exacting requirements. SawStreet works with a wide range of substrates including Silicon, SiGe, GaAs, GaN, InP, MEMS, and ceramic to name a few. We also work with substrates as thin as 50 microns. Team with SawStreet on your next challenging project!

SawStreet is a Service Disabled Veteran Owned Small Business (SDVOSB)