SawStreet's automated pick and place equipment ensures the highest quality pick at competitive prices. SawStreet takes great care not to damage the topside of your die, by utilizing the most precise setup and sensitive tools. From nitrile tips to perimeter pick collets, we will ensure your yield is maximized.
SawStreet can pick virtually any substrate material and has picked die as thin as 50 micron (0.002"). We can pick from either UV or Non-UV tape. Though we have standardized on certain UV and Non-UV tape we will use any tape manufacture you might specify. Sawstreet can work with ink dots for electronic maps and offers up to 16 different binning options.
While many of our customers prefer us to pick to waffle or gel packs, we also pick to grip rings or frames for shipment to customers.
|Size:||≤ 200 mm diameter (8 inches)|
|Substrate Thickness:||≥ 50 microns (2 mils)|
|Die Size:||≥ 200 x 200 µm (8 x 8 mils)|
|Bumped Wafers, Ink Dots & Electronic Maps||OK|